Flexible Copper-Clad Laminate (S’PERFLEX)

Flexible Copper-Clad Laminate (S’PERFLEX) offers the following features:

Ultra-Thin Copper Layer
Uniform layer from 0.1 µm to 9 µm enables precise patterning

Folding Endurance
Low spring-back supports thinner, more flexible devices.

Transparency
Flat film-metal interface, suitable for transparent materials

Flatness
High insulation reliability due to a flat film-metal interface.

Note: The values shown above are nominal values from our R&D. Please share your requirements so we can discuss detailed specifications.

Sumitomo Metal Mining's Flexible Copper-Clad Laminate (S’PERFLEX) is a flexible substrate material with a copper layer that is formed on various organic resin films, such as polyimide films or clear films. The flat film-metal interface and the thin, uniform copper layer enable precise patterning. Transparent FCCL, which has a copper layer that is formed on clear films, enables the fabrication of products such as transparent antennas and transparent FPCs.

Microfabrication

・The flat film-metal interface and thin, uniform copper layer enable high-precision patterning.
・The copper layer thickness can be adjusted from 0.1 µm to 9 µm to suit subtractive or semi-additive processes (SAP, MSAP).

Various Applications

・Capable of fabricating FCCL with various organic resin films.
・FCCL with a 12.5 µm-thick polyimide film enables thin, highly integrated electronic devices.

High Transparency

・By eliminating adhesive between the transparent film and the copper layer, the FCCL retains the smooth film surface and maintains transparency even after circuit patterning.
・Various transparent films can be applied to suit different applications: PET film, colorless heat-resistant PI film, or COP film with high transparency and low transmission loss for transparent displays, FPCs, antennas, or heaters.

Lightweight and Flexibility

Metallized FCCL is expected to replace traditional FCCL with copper foil in applications that must be thin, light, and flexible.

・You can select from a range of film and copper-thickness combinations.
・For Sumitomo Metal Mining's copper clad laminate, you can choose various organic resin films and copper layers in your required thickness. Please share your requirements.

For detailed product information and specifications, download the data sheets below.

Usage

FCCL serves as a material for patterning various electrical circuits. You can select the thickness of the copper layer to match the processing method. For example, the thickness ranges from 0.1 to 4 µm for the semi-additive process (SAP) or the modified semi-additive process (MSAP), from 6 to 8 µm for the subtractive process, and from 2 to 5 µm for the subtractive process that has panel-plated through-holes. Transparent FCCL made with clear films enables the fabrication of transparent FPCs without impairing visibility. Sumitomo Metal Mining's FCCL uses a roll-to-roll process suited to mass production. The FCCL can also substitute for copper foil in parts that need to be thinner, lighter, and more flexible.

Applications

Sumitomo Metal Mining's FCCL serves mainly as a material to fabricate substrates for mounting driver ICs in LCD and OLED displays. These displays are found in TVs, monitors, mobile PCs, smartphones, and tablets. In the future, manufacturers expect to use these displays in electronic paper and in-vehicle monitors. Transparent FCCL that is made with clear films works well for transparent displays, FPCs, antennas, and heaters.

・Copper Clad Laminate (2-layer FCCL) without adhesive: Conventional CCL that uses adhesives can cause short circuits from metal residue after fine patterning. Sumitomo Metal Mining's 2-layer FCCL has resolved this issue in some cases, improving the reliability of driver-IC circuits for LCD and OLED displays.

・Copper Clad Laminate (Transparent FCCL) with transparent films: Fabricating transparent antennas or FPCs requires resolving the trade-off between transparency and conductivity. Sumitomo Metal Mining's 2-layer FCCL enables precise patterning while preserving visibility by maintaining line linearity after processing. This can expand the range of new products such as transparent antennas, heaters, and displays.

How is FCCL used?

A: FCCL is used as a base material to form electrical circuits for devices. For example, Sumitomo Metal Mining's FCCL has been used as the base material for substrates that mount a driver IC to control the displays of TVs, monitors, mobile PCs, smartphones, and tablets.

What are the main features of FCCL?

A: A key feature of Sumitomo Metal Mining's FCCL is its flat film-metal interface, which solves several problems. For example, when a fine circuit cannot be formed because of an uneven patterning surface, the flat interface improves the pattern's linearity and width uniformity. Further benefits include:

(Examples)
・High-precision patterning that ensures long-term insulation reliability.
・Improved folding endurance that extends the life of FPCs for foldable devices.
・Faster transmission with low signal loss at high frequencies.
・Better transparency in transparent FCCL, preserving visibility after patterning.

What makes Sumitomo Metal Mining's FCCL different from other materials?

A: Sumitomo Metal Mining's FCCL contains no adhesive. It is made by forming a copper layer directly on various organic resin films using advanced metallizing technology, so you can freely select the copper-layer thickness and film type to suit your requirements.

(Combination example)
・FCCL with a thin film → Suitable for FPCs with low spring-back, or as a substitute for copper foil.
・FCCL with a transparent film → Suitable for transparent FPC applications.

What processes is FCCL used with?

A: FCCL is used to fabricate FPCs with the SAP, MSAP, and subtractive processes. Transparent FCCL with a thin copper layer can form thin, narrow patterns without impairing visibility. FCCL can also substitute for copper foil where light weight and flexibility are required.