Nano Copper Powder with Oxidation Resistance
(R&D)

The Nano Copper Powder offers the following features:

Excellent oxidation
Enables handling
in air.

Superior low-temperature sintering,
Starts at around200℃*

Sharp particle size
Delivers high monodispersity
for consistent quality**

Diverse Fine-Particle Lineup
Available in multiple particle sizes to suit various applications

*Despite its fine-particle size, the powder features an organic coating on the surface that ensures very slow oxidation at temperatures ranging from room temperature to below 160°C. This coating results in excellent stability during storage and easy handling, and the powder can also be managed in the atmosphere at temperatures below 160°C.
**Our unique wet-process powder-control technology achieves a sharp particle-size distribution and high monodispersity. Because the powder is composed of nearly 99% copper, it allows for the formation of dense sintered surfaces with minimal impurities at low temperatures.

Sumitomo Metal Mining's Nano Copper Powder with Oxidation Resistance (UCP series) has a uniform particle-size distribution. This distribution allows low-temperature sintering by bonding particles well below the copper melting point.
A unique organic surface coating gives the powder its oxidation resistance, so it can be handled in air from room temperature up to 160°C. Demand is rising for copper powders that sinter at temperatures gentle enough for heat-sensitive components such as resin substrates.

Low-temperature-sintering copper powders with particle sizes of 200 nm, 300 nm, and 400 nm

Generally, lowering the sintering temperature of metal particles can be achieved by making the particles finer. However, for copper powders, fine particles tend to oxidize easily. This tendency makes handling more difficult.

Using wet-synthesis techniques refined over many years, Sumitomo Metal Mining has developed copper powders with particle sizes of 200 nm, 300 nm, and 400 nm that balance easy handling with low-temperature sintering.

By offering a lineup of fine-particle sizes, we aim to speed up customer development. Additionally, by leveraging the unique properties of fine particles, we can enhance performance not only in the field of electronic materials but also in applications such as antibacterial materials.

Sumitomo Metal Mining offers a development-product series of Nano Copper Powder with Oxidation Resistance. If your requirements are not listed, please contact us.

Note: The average SEM particle size is representative.
These materials have the following anticipated applications:
・Conductive materials
・Electromagnetic shielding materials
・Conductive fillers
・Antibacterial materials

For detailed product information and specifications, download the data sheet below.

Applications for these materials include the following:

• Paste production
• Ink production
• Additives
• Powder metallurgy
• Incorporation into various materials

Forming copper electrodes brings several challenges: preventing aggregation, lowering the sintering temperature, and maintaining quality (oxidation resistance).
Sumitomo Metal Mining's Nano Copper Powder with Oxidation Resistance (UCP series) starts sintering at lower temperatures than atomized copper powders, depending on the environment and other conditions. It can be used on its own or as a sintering aid to lower the sintering temperature of other copper powders.
A special surface treatment keeps this fine powder highly oxidation-resistant, which improves its dispersion in organic solvents and the stability of the paste. If you need smooth, thin copper-electrode films, consider Sumitomo Metal Mining's Nano Copper Powder with Oxidation Resistance.

Learn how the UCP series enables low-temperature copper-electrode formation

What is the main application of copper powder (UCP series)?

A: The UCP series has excellent oxidation resistance and low-temperature sintering properties. These properties make it suitable for metal filler in conductive paste or ink, and for sintering paste for die-attach applications. Copper powder is also used in powder metallurgy and antimicrobial applications.

Can the UCP series be used in combination with other copper powders?

A: The UCP series is a low-temperature-sintered copper powder characterized by its uniform particle size. By combining the UCP series with other copper powders, you can increase packing density, lower sintering temperatures, and improve other properties.

Does this copper powder have water repellency?

A: No. Our UCP series can be easily dispersed in polar solvents such as water.