Article
Features of High-Density Printed Circuit Boards
Achieves higher functionality in finished devices through miniaturization, low-profile design, and higher density
Higher density
Step structures and embedded components enable thin, high-density mounting.
Fine processing
Creates high-precision free-form shapes and micro-holes through blasting.
High reliability
Designed with thermal management considerations to ensure stability and dependability for long-term use.
Design flexibility
Enables advanced functionality and complex device configurations by using cavity structures (steps) and blasting processes.
High-density printed circuit boards combine structural design with machining technologies to support the miniaturization and extended functionality of electronic devices. By combining step and recessed structures with processing of micro-holes and narrow slots, they enable highly functional designs in limited spaces. They also enable high-density mounting and precision structures, even on conventional flat boards, and enhances freedom of design for next-generation devices.
This page introduces (1) the cavity structure that lowers mounting height with step and recess designs, and (2) thin-board blasting process that handles free-form shapes, micro holes, and narrow slits.
Technology for High Density: Cavity Structure
Miniaturization, low profile, and higher density through stepped designs
A cavity board is a printed circuit board with recesses (cavities) formed in the board, allowing electronic components to be placed within the board. By using the steps, it can achieve miniaturization, a lower profile, higher density, and better heat dissipation. It can also reduce resin-molded parts and streamline assembly, making it an effective technology for electronic devices and module boards that require minimization.
Issues solved by cavity structures
Below are some examples of how cavity structures have provided solutions to solve design challenges that were difficult to address with conventional boards.
- Needing to keep component heights down due to mounting height constraints
- Wanting to shorten wiring distances and improve design options
- Wanting to reduce (assembly hours)
By adopting a cavity structure, module boards can be made thinner and lower profile, helping to miniaturize the final product. It also shortens the distance between components, giving designers more freedom.
Functional Features of Cavity Structures
Miniaturization and lower profile
By forming recess (cavities) in the board and mounting electronic components there, the module can be downsized and minimalized.
Higher density
Using cavity structures makes it easier to place components in limited space, supporting high-density mounting.
Assembly
By using the cavity walls, the resin-molded parts needed for module assembly can be reduced. This helps streamline the resin parts, reduce molding, and reduce time, contributing to more efficient assembly.
Examples of Cavity Board Applications
Cavity boards can be applied as follows.
| Application | Details |
|---|---|
| RF modules | Improves high-frequency characteristics through shorter wiring, module downsizing and minimalization, and enhanced shielding performance. |
| MEMS sensors | Protects sensing elements, secures sensing space, and optimizes the sealing structure. |
| Power devices | Provides space for mounting large chips, improves design flexibility, and enhances heat dissipation and mounting reliability. |
| Optical devices | Smaller, lower-profile modules with space for optical paths and alignment. |
Products under-development using cavity technology
Semi-Flex PCB
A printed circuit board, in which part of a conventional rigid board is thinned enough to be bent, can be used in applications that do not require repeated flexing like a rigid-flex board, and enables 180-degree bending without connectors or cables.
*You will be redirected to Shinko Co., Ltd.'s website in Japanese.
