Powder Materials
Nano Copper Powder with Oxidation Resistance (R&D)
Sinters in air at temperatures as low as 200°C. Our UCP series nano copper powder combines tight particle-size control with an organic surface coating that resists oxidation up to 160°C.
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Ultrafine Nickel Powder (R&D)
Particles under 0.1 μm, made via wet chemical synthesis. High dispersibility and low impurities make it suitable for MLCC internal electrodes.
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Iron-Nickel-Cobalt Alloy Powder (R&D)
Made via wet chemical synthesis, with a narrow particle-size distribution from 0.2 to 1.0 μm. Used in inductor cores, EMI shielding, catalysts, and forming materials for powder metallurgy, metal injection molding, and 3D printing. Explore Iron-Nickel-Cobalt Alloy Powder
Wellmax™ Magnet Materials
Wellmax™ delivers high-performance SmFeN magnets that match the magnetic properties of neodymium magnets, while using surplus samarium to ease supply-chain risk. Explore Magnet MaterialsPastes & Inks
Near-Infrared-Absorbing Materials (SOLAMENT™)
SOLAMENT™ selectively absorbs near-infrared rays while keeping high visible-light transmittance, at 1/6 to 1/50 the dosage of ITO. It suits heat-shielding window film, building and glazing materials for carports and sunrooms, agricultural films, and functional textiles. Explore Near-Infrared Absorbing Materials
MOD Paste — Metal Organic Decomposition Paste (R&D)
MOD Paste (Metal Organic Decomposition Paste) prints conductive circuits on low-temperature resin substrates. Its oxidation resistance opens new options for printed electronics. Explore MOD Paste
Thick Film Paste
Engineered for electrical conductivity, uniform dispersion, and strong adhesion. We customize formulations to match your circuit design and substrate requirements.
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AuSn (Gold-Tin) Solder
High-purity AuSn (gold-tin) eutectic solder with outstanding wettability. Suited for fine-pitch semiconductor packaging and high-reliability optoelectronic assemblies.
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Flexible Copper-Clad Laminate — 2-Layer FCCL and Transparent FCCL
Ultra-thin flexible laminates with uniform copper layers and smooth interfaces — ideal for fine-circuit patterning. Transparent FCCL variants suit transparent antenna applications.
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