Case
Features of Thick-Film Pastes
Advanced dispersion technology for high-precision paste.
Thick-Film Pastes offers the following features:
Temperature-Stable Performance
TCR control extends the usable temperature range of devices
High ESD Resistance
Safeguards electronic components from static damage
Stable Dispersion Control
Good dispersibility delivers stable printability and consistent performance
Properties of Thick Film Paste
Control of TCR* and high ESD** resistance.
Thick-film pastes consists of metal powder, glass powder, inorganic oxide powder, and resins that are dispersed in an organic solvent to achieve the required functionality. It is used for electrodes, resistors, and insulators in small electronic components.
Thick-film pastes must meet requirements such as electrical performance, uniform dispersibility, smoothness and adhesion during drying, and controlled shrinkage during sintering. Sumitomo Metal Mining has both the metal-powder manufacturing technology and the paste formulation technology to produce Thick-film pastes that is tailored to each customer's application.
*TCR (Temperature Coefficient of Resistance):
TCR indicates how much a resistor's resistance changes as temperature varies. A smaller TCR value means the resistance stays more stable despite temperature changes; therefore, electronic devices are less affected by temperature.
**ESD (Electrostatic Discharge):
ESD is the sudden release of accumulated static electricity, which can damage electronic components and circuits. Managing ESD is important in the design and manufacturing of electronic devices.
Lineup of Thick-Film Pastes
Our lineup includes resistive and conductive pastes.
Sumitomo Metal Mining's main Thick-film pastes lineup includes chip resistor pastes that are widely recognized as industry standards, electrode pastes customized to customer requirements, and conductive adhesives for die-attaching chip components in IC* and LED assemblies.
We also develop Thick-film pastes tailored to specific customer requirements.
・Conductive Paste: Forms conductors using conductive metals such as Au, Ag, Pd, Ni, and Cu.
・Resistive Paste: Forms resistors that contain Ru.
・Insulating Paste: Forms insulators that protect circuits, mainly using glass or resin.
・Resin Paste: Leaves resin after curing to provide adhesion.
If our standard lineup does not meet your requirements, please contact us for custom solutions.
| Current Typical Application | Type of Paste | Type | Features |
|---|---|---|---|
| Paste for chip resistors | Resistive paste |
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| Conductive paste |
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| Glass paste |
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| Circuit pattern forming | Cupper paste |
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| Paste for Die-attach | Conductive paste | For LED | Small ICs |
| Non-conductive paste | For LED | High ultraviolet resistance and high heat resistance for GaN-based LEDs. |
*IC (Integrated Circuit)
An IC combines passive and active components inseparably on a single substrate.
Access Detailed Information
Download Materials for Thick-Film Pastes
For detailed product information and specifications, download the data sheets below.
Copper-Paste For Circuit-Forming
KG-2438
- Features
- Typical Product Specifications
- Recommended Process Conditions
- Characteristics
Applications and Usage Examples of Thick Film Paste
Applications in electronic materials.
Thick-film pastes are used for electrodes, resistors, and insulators in small electronic components. Our lineup includes chip resistor pastes that are widely recognized as industry standards, electrode pastes customized to customer requirements, and conductive adhesives to die-attach chip components in IC and LED assemblies.
Case Studies of Thick-Film Pastes
Case studies in wide temperature ranges.
As mobility and IoT applications spread, demand has grown for reliable electronic components that can perform under extreme temperatures. Resistors play an important role in these components, handling tasks such as current control, voltage distribution, and signal processing.
By combining the properties of metals and semiconductors, the TCR value of a resistor can be stabilized, which makes it suitable for a wide range of uses.
High-precision TCR-resistive pastes from Sumitomo Metal Mining delivers stable performance over a wide temperature range. This paste is suitable for mobility-related electronic components and many other applications. See the case studies for specific examples of TCR control.
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Materials
Introducing Sumitomo Metal Mining’s material products,
which are the starting point for X-MINING innovation.
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Near-Infrared-Absorbing Materials
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Magnetic
Materials -
Oxidation-Resistant Nano Copper Powders (R&D)【R&D】
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Metal Organic Decomposition (MOD) Paste【R&D】
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Ultrafine Nickel Powders【R&D】
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Iron-Nickel-Cobalt Alloy Fine Powder【R&D】
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Fe-Ga Alloy Single Crystal【R&D】
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AuSn (Gold-Tin) Solder
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Flexible Copper Clad Laminate
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High-Density Printed Circuit Boards