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Technological progress should benefit us all.
For over 430 years, Sumitomo Metal Mining has been working with copper,
advancing our technology by mining, smelting and refining techniques,
supplying it as a material that supports the world.
Through it all, one simple pursuit has remained
at the heart of our work:
to bring the value of copper to all.
And as we move into a new era, that pursuit remains unchanged.
Could we evolve a material as enduring as copper at the nanoscale,
and give it new life as an advanced material?
Could a metal as common and accessible as copper take on functions
once exclusive to precious metals like gold and silver?
Could we reuse the copper that is already plentiful in our cities
to create a more sustainable and reliable cycle?
Across mobility, energy and beyond, technology is advancing every single day.
Our goal is to make sure that progress reaches all,
and to bring to life a hopeful tomorrow where no one is left behind.
So we will keep pushing the possibilities of copper. For all.
CuALL™ (pronounced “cue-all”) is a functional materials technology born from copper innovation. Using a proprietary surface treatment to prevent oxidation, CuALL™ transforms copper into nanoscale particles, unlocking unprecedented possibilities.
For example, CuALL™ can be used as a bonding material for semiconductors that power EVs and wearable devices. In paste or ink form, it can also be used to print circuits onto a wide range of materials. By evolving the copper that is already all around us, CuALL™ can help make cutting-edge technology accessible to all.
Today’s society faces a range of challenges that need to be addressed. Growing energy consumption is putting pressure on the environment and driving up resource costs. At the same time, widening economic inequality means the benefits of new technology often reach only a few. By putting its unique capabilities to work across a wide range of fields, CuALL™ can help us tackle social challenges like these.
As an alternative to precious metals in semiconductor bonding, CuALL™ could help reduce the cost of electronic circuits used in EVs and beyond. This could help make mobility infrastructure more accessible to all, from rural communities to major cities.
If widely used in data centre semiconductors, CuALL™ could help reduce power consumption, lowering server heat and the energy needed for cooling. By printing circuits only where necessary, it also has the potential to reduce metal waste and support a more sustainable generation of AI.
CuALL™ could enable the integration of advanced sensors into a wide range of objects and environments. Across areas like autonomous driving, smart cities, and healthcare, this could help enable cyber-physical systems where the physical and digital worlds work together.
