X-MINING Low Temperature Sintering to Form Copper Electrodes Nano Copper Powder with Good Oxidation-resistant

=Customer’s requirements =

“We need copper powder with good dispersion that can form thin copper electrode films and does not aggregate.”

“We need copper powder that can be sintered at low temperature to achieve electrical conductivity.”

“We need solutions to lower the sintering temperature based on the copper powder we are currently using.”

“We need copper powder that is resistant to oxidation even if exposed to the air.”

“We need copper powder that can be sintered at a low temperature of less than 300°C to substitute silver powder, but we do not want to use Nano Copper Powder with Good Oxidation-resistant which oxidizes easily.”

It is expected that demand for copper-based conductive materials is expected to grow and diversify due to energy-saving requirements, the expansion of electric vehicles, and continued innovation in electronics manufacturing.

Can these challenges be addressed by leveraging the unique features of our copper powder?

Sumitomo Metal Mining has developed an Nano Copper Powder with Good Oxidation-resistant (UCP series) with a finer and narrower particle size distribution than conventional atomized copper powders.

The UCP series is designed to support low-temperature sintering (below 300°C) and improved oxidation resistance, helping reduce oxidation-related limitations often associated with finer copper particles.

Sintering is the process of bonding particles together into solid mass by heat or/and pressure without fully melting particles.
In general, sintering is accelerated at higher temperatures, and the rate of sintering densification varies depending on material properties such as particle size, shape, and surface condition.
Copper-based materials are expected to be promising candidates for such needs, but copper is more prone to oxidation than silver—and this challenge becomes more severe as particles become finer to improve low-temperature sinterability. Therefore, it is essential to engineer the particle surface to mitigate oxidation without inhibiting sintering.

Our Nano Copper Powder with Good Oxidation-resistant, UCP series, has the strengths of low-temperature sintering and oxidation resistance.
In addition, UCP series is also characterized by its submicron size, which is classified as ultrafine powder.

Low temperature sinterability

This material has a finer and sharper particle size distribution compared to general atomized copper powder. It can be used as a alone conductive powder or as a sintering additive blended with larger-particle copper powders to help lower the overall sintering temperature.

Oxidation resistance

Since the antioxidant coating and surface of copper powder are directly connected without the oxide layer, this copper powder is not easily oxidized even when exposed to air at room temperature.
Our copper powder is not only easy to handle, but also take advantage of robustness when it is used as conductive filler for paste of ink.

Nano Copper Powder with Good Oxidation-resistants(UCP series)

Measurement of oxidation of UCP series in Air

By adjusting the mixing ratio of the UCP series, it is possible to tune sintering behavior to meet different processing requirements.
Because the UCP series is submicron-sized (ultrafine) and oxidation-resistant, it can help start temperature of sintering is as low as 210℃, and it can also be used as a sintering additive material for other atomized copper powders of a larger particle size.

The figure shows the volume change rate of our Nano Copper Powder with Good Oxidation-resistant UCP series during heating in a reducing atmosphere.

Sintering behavior of UCP series

Note: The sintering temperature depends on the sintering conditions, so please use this data as a reference.

In addition to low-temperature sintering and oxidation resistance, our Nano Copper Powder with Good Oxidation-resistant has a sharp particle size distribution and is easy to handle even in the atmosphere.

Copper has low electrical resistance and excellent thermal conductivity, and can be expected to be applied to a wide range of electronic components.
In recent years, the antimicrobial properties of copper have also received much attention. Our Nano Copper Powder with Good Oxidation-resistant has a narrow particle size distribution and is easy to handle in the atmosphere.
The functions of “preventing” oxidation and the growth of bacteria can be applied to other fields as well.
We would like you to utilize our “Nano Copper Powder with Good Oxidation-resistant” in various fields, and realize your ideas together.

Copper has low electrical resistance and excellent thermal conductivity, and can be expected to be applied to a wide range of electronic components.
In recent years, the antimicrobial properties of copper have also received much attention. Our Nano Copper Powder with Good Oxidation-resistant has an narrow particle size distribution and is easy to handle in the atmosphere.
The functions of “preventing” oxidation and the growth of bacteria can be applied to other fields as well.
We would like you to consider to realize your imagination with our “Nano Copper Powder with Good Oxidation-resistant” in a variety of fields, not limited to electronic components?