MOD Paste (Metal Organic Decomposition Paste)
(R&D)

Achieving Copper-like Conductivity, Thick Film Formation, and Low-Temperature Processing

Oxidation Resistance:
Excellent oxidation resistance
allows it to withstand solder
reflow processes.

Low-temperature Wiring:
Formation on Polyimide
Resin Substrates

Thick Film Formation
with Proprietary Low-Temperature Sintering
Copper Powder in Metal
Complex Ink

High Conductivity
Achieved Through Sintering, Close to Copper metal

Next-Generation Wiring Materials: Enables thick film printing, improved oxidation resistance, and innovative circuit formation technologies.

Sumitomo Metal Mining's MOD paste (Metal Organic Decomposition Paste) is developed as a material for printed electronics, the next-generation circuit formation technology. It features high conductivity close to that of copper metal, low temperature sinterability, and oxidation resistance. By using the MOD ink and Sumitomo Metal Mining's low-temperature sinterable fine copper powder, it allows flexible film thickness control from thin to thick films, making it applicable for a wide range of devices from compact and lightweight to large-area devices.

The fundamental construction combines fine copper powder, which sinters at temperatures around 200°C, with MOD ink as the base for MOD Paste. MOD ink basically consists of Copper (Cu) and Nickel (Ni) complex liquid. By using this MOD ink, MOD paste could have low temperature sinter ability and highly oxidation resistance.

MOD Paste and MOD ink (Metal Organic Decomposition ink) as the Base for MOD Paste

Solving Challenges in Next-Generation Printed Electronics

Achieving process simplification and environmentally friendly circuit formation by reducing energy consumption and improving film thickness during printing.

The metal complex conductive paste is a conductive material for printed electronics that enables low-temperature sintering, primarily using metal complex ink and copper powder.

Printed electronics is a next-generation technology that forms electronic circuits by printing metal films only where needed. Conventional inks using silver or copper nanoparticles are expensive and limited in application due to design restrictions like oxidation reliability and thin film thickness.

Our conductive paste overcomes these challenges by combining metal MOD ink with low-temperature sinterable fine copper powder and nickel for oxidation resistance, achieving an ink capable of forming thick films that boast high conductivity, suitable for large-area and high-current applications.

Material：Fine Copper Powders

For more details, please download our materials on MOD paste.

MOD Paste is considered for a variety of uses, reflecting its wide range of potential applications.
The following applications are expected:

The superior low-temperature sinterability of the MOD Paste finds application in key technologies for realizing an IoT society. Unlike traditional subtractive methods that involve etching, printed electronics use an additive process, applying conductive ink/paste only where needed, reducing material usage, environmental impact, and manufacturing costs. This paste is suitable for thin, lightweight, and flexible electronic devices, applicable in automotive wiring, solar cells, wearable devices, sensor devices, RFID tags, and more.

Our dialogue content “X-TALK” features discussions with guests from inside and outside the company, including articles on the future of printed electronics.

[Read the Interview Article] Utilization of Paintable Metals: Market Scale and Future Prospects of Printed Electronics

Example: Oxidation-resistant copper circuits on transparent polyimide substrates achieve over 30 micrometers in thickness, compared to the usual 10 micrometers of metal complex ink without added copper powder.

How is the MOD paste manufactured?

The paste is made by adding fine copper powder, developed by Sumitomo Metal Mining, to MOD ink a solution containing copper and nickel complexes. The solution is then adjusted to an appropriate viscosity process. For more details, refer to our downloadable materials.

What applications are suitable for MOD paste?

MOD Paste offers high conductivity and cost-effectiveness, making it suitable for applications requiring large areas and large quantities of material. Its adjustable thickness allows printing from thin to thick films, expanding its applicability to compact devices and printed electronics.

What printing technologies can this paste be used with?

Primarily screen printing. Other printing methods, such as gravure offset printing, are being investigated to accommodate fine lines and complex shapes. We can also modify the product design to fit specific printing methods; please feel free to consult with us.

Is there a product for MOD ink alone?

Yes, MOD ink, used as a raw material for conductive paste, can also be considered as a standalone conductive material. For example, using it with inkjet processes for thin films and fine lines is feasible. Tailored designs can be created based on your requirements.

Can you provide printed circuit boards using this material?

Since the use of this material varies depending on our technical know-how about processing conditions, we are considering producing prototype samples according to your requested circuit patterns during the development stage. We will support you as your development progresses.
In addition, we can form electrodes with high adhesion by utilizing our knowledge of pre-treatment technology cultivated through copper polyimide substrate manufacturing.