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Sumitomo Metal Mining to Exhibit at “TechBlick ~ The Future of Electronics RESHAPED ~” in Boston, USA
Sumitomo Metal Mining to Exhibit at “TechBlick ~ The Future of Electronics RESHAPED ~” in Boston, USA
Sumitomo Metal Mining Co., Ltd. will participate in the electronics exhibition “TechBlick ~ The Future of Electronics RESHAPED ~” to be held in Boston, USA on June 11–12, 2025. At our booth, we will showcase our newly developed conductive material for printed electronics, the MOD Paste (Metal Organic Decomposition Paste)
During the exhibition, we will introduce wiring boards featuring electronic circuits printed with our metal-organic conductive paste, demonstrating the potential and application of this technology.
Event Details
| Event: | TechBlick～THE FUTURE OF ELECTRONICS RESHAPED |
|---|---|
| Date: | June 11–12, 2025 (local time) |
| Venue: | Boston, USA |
| Official Website | https://www.techblick.com/electronicsreshapedusa |
| Our Booth | F0 (Booth Map is here) |
About TechBlick
The Future of Electronics RESHAPED conference and exhibition is where the global additive, sustainable, hybrid, and 3D electronics industries connect. It is the largest and most important conference and exhibition for this field in North America. This event serves as a global hub for additive manufacturing, including printed electronics, as well as sustainable, hybrid, and 3D electronics.
(https://www.techblick.com/electronicsreshapedusa)
About Printed Electronics
Printed electronics is a promising technology that addresses various societal needs, such as energy and resource conservation, miniaturization and lightweighting of electronic devices, flexible electronics, proliferation of IoT devices, and reduction of manufacturing costs. Through this exhibition, we aim to promote printed electronics technology, exchange ideas with industry professionals from around the world, and explore the potential applications of our metal-organic conductive paste.
Sumitomo Metal Mining’s Metal-Organic Decomposition (MOD) Paste
Our MOD paste is a next-generation wiring material designed for thick-film printing. Developed as a key material for the emerging field of printed electronics, it features high conductivity, excellent oxidation resistance, and is capable of forming thick conductive layers. Its versatile properties make it suitable for various innovative circuit formation applications.
[Learn more about our MOD Paste (Metal Organic Decomposition Paste)]
If you have any questions or need further information, please feel free to contact us through our [inquiry form]