Thermal Grease
(R&D)

Non-silicone-based TIM combines heat resistance and high durability are developed.

Currently, silicone-based materials are predominantly used for TIMs in power semiconductors due to their heat resistance. However, silicone-based TIMs have a known risk of contact failure due to siloxane released from the silicone, posing a reliability issue for devices.

Our non-silicone thermal grease that greatly improves the heat resistance, which was a weakness of conventional non-silicone TIMs, and we are exploring the needs for reliable thermal management materials.

■Heat Resistance: The paste contains high thermal conductivity fillers, significantly improving heat resistance compared to conventional non-silicone products.
■Printability: Maintains a viscosity suitable for printing, and successfully suppresses bleed-out despite the high filler content.
■Low Viscosity: Low viscosity with high thermal conductivity, making it easy to apply.

Please refer to the following columns for more information on thermal grease:

Article : Non-silicon Based High Heat-Resistant Thermal Grease(Thermal Paste) is here.
Heat Radiating Material(Heat Conducting Composite) is here.

For more information on the characteristics of the samples, please use the registration form below to download the documents and contact us using the inquiry form.

If the product you are looking for is not in our lineup, please feel free to contact us.

	Development Samples
Grade Examples	＃1	＃2		＃3
Features	Prevention of oil and filler separation, along with low Bond Line Thickness (BLT).	Prevention of Oil and Filler Separation and Low Bleed-out		Prevention of Oil and Filler Separation and Low Bleed-out
		Conductive Filler	Insulating Filler	Conductive Filler	Insulating Filler
Thermal Conductivity (W/mK)	1.1	1.1	1.2	3.0	2.9
Minimum Layer Thickness (μm)	6	17	19	30	25
Density (g/cm3)	2.7	1.9	2.0	2.4	3.1
Viscosity (Pa-s)*	115	88	105	88	100
Up to 150°C TG Weight Change (%)	≦±0.2
Bleed Out***

	Development Samples
Grade Examples	＃4		＃5
Features	High thermal conductivity achieved alongside and low viscosity.		High thermal conductivity with pump-out control (please consult us regarding reducing viscosity).
	Conductive Filler	Insulating Filler
Thermal Conductivity (W/mK)	4.7	5.1	8.1
Minimum Layer Thickness (μm)	25	43	42
Density (g/cm3)	2.4	3.2	4.7
Viscosity (Pa-s)*	104	129	630
Up to 150°C TG Weight Change (%)	≦±0.2
Bleed Out***

For more details, please download for detailed product information, including specifications.
Click below to access.

With the advancement of high-performance electronic devices, heat issues have become evident, and performance degradation due to overheating is a common problem. Thermal grease is a crucial component to maximize the performance of high-performance electronic and industrial equipment. Modern devices are becoming increasingly high-functioning and compact, leading to increased heat generation. Effective thermal management is essential for the longevity and stable operation of these devices. Here, we introduce the fields in which our thermal grease is utilized and its expanding potential.

• Cooling of high-performance PCs
• Prevention of overheating in gaming computers
• Cooling of equipment in server rooms
• Enhanced cooling of graphics cards
• Temperature management of audio equipment
• Industrial equipment with measures against thermal runaway
• Protection of electronic devices in high-temperature environments

*Measured at a shear rate of 10/s at 25°C.
**Tested by applying to glass and heating at 150°C for 1 hour.
***The new type maintains a minimal layer thickness while achieving both high thermal conductivity and low viscosity.

What are the advantages of silicone-free Thermal Grease?

No siloxane gas, which can cause contact failure gas and lens fogging, is generated.

What is the heat resistance temperature of Thermal Grease?

Our Thermal Grease achieves heat resistance of 150°C or higher, which is difficult to achieve with conventional non-silicone one.

In what applications is Thermal Grease used?

A common application of TIM products is heating dissipation, mainly in electronic devices. They are used in areas where heat generated by electrical resistance can be discharged, such as CPU cases in PCs and electronic devices in hybrid vehicles.