Powder Materials
Fine Copper
Powder: R&D
Our fine copper powder features uniform particles and low temperature sinterability, allowing use in air up to 160°C.
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Ultra-fine Nickel Powder: R&D
Developed via a unique wet process, with particles under 0.1μm, excellent dispersibility, and low impurities, making it suitable for electronics.
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Iron-Nickel-Cobalt Alloy Powder: R&D
Developed using wet synthesis technology, it has fine particles ranging from 0.2 to 1.0μm with a narrow size distribution.
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Magnet Materials
Our Wellmax™ series uses surplus samarium (Sm) to produce high-performance samarium iron nitrogen (SmFeN) magnets.
For more information about Magnet MaterialsPaste & Ink
Near-infrared Absorbing Material
Our unique inorganic material has high visible light transmission and strong near-infrared absorption with excellent weather resistance.
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Metal Complex Conductive Paste: R&D
Our next-generation wiring material suits thick film printing and is oxidation-resistant, enabling circuit on low-temperature resin substrates.
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Thick Film Paste
With electrical properties, uniform dispersibility, and adhesion, our technology customizes materials to customer needs.
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Thermal Grease: R&D
With excellent heat resistance, low viscosity, and high thermal conductivity, addressing conventional TIM weaknesses.
For more information about R&D: Thermal GreaseAlloy Materials
AuSn (Gold-Tin) Solder
High-purity Gold-Tin solder has excellent wettability suitable for ultra-fine processing and high-reliability electronics.
For more information about AuSn (Gold-Tin) SolderPackaging Materials
Copper Clad Laminate
(2-layer FCCL, Transparent FCCL)
Thin, flexible laminates with smooth interfaces and uniform copper layers for fine circuits, including transparent FCCL for antennas.
For more information about Packaging MaterialsCrystal Materials
Iron-Gallium (Fe-Ga)
Magnetostrictive Alloy Single Crystal: R&D
Iron-Gallium is used for IoT vibration energy harvesting, with high-quality single crystals grown using the Bridgman method.
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