- Near-Infrared Absorbing Materials
- Thick Film Pastes
- Magnetic Materials
- Fine Copper Powders
- MOD Paste (Metal Organic Decomposition Paste)
- [Wet-chemical synthesized metal powder] Ultra-fine nickel powders
- Fe-Ga Alloy Single Crystal
- Thermal Grease
- AuSn (Gold-Tin) Solder
- Copper-clad laminate (2-layer FCCL, transparent FCCL)
Near-Infrared Absorbing Materials
-
Optical Data Sheet
YMF-02A
INDEX- Optical measurement procedure
- Optical properties
-
Optical Data Sheet
YMDS-874
INDEX- Optical measurement procedure
- Optical properties
-
Optical Data Sheet
KHF-7AH
INDEX- Optical measurement procedure
- Optical properties
Thick Film Pastes
-
Copper-Paste For Circuit-Forming
KG-2438
INDEX- Features
- Typical Product Specifications
- Recommended Process Conditions
- Characteristics
Magnetic Materials
-
Wellmax™
Bonded Magnet Materials of SMM
INDEX- Features of Wellmax™
- Higher rust resistance than NdFeB magnets
- Reduction of Weight and Cost with Wellmax™
- Make differentiations throught injection molding
- Application examples of Wellmax™
-
Wellmax™-S1
Anisotropic SmFeN (Samarium-Iron-Nitrogen) magnet powder
INDEX- Composition
- Particle size distribution and SEM appearance
- Magnetic properties and demagnetization curve
-
Wellmax™-S3 Series
Anisotoripic SmFeN (Samarium-Iron-Nitrogen) PA12 magnet pellet for injection molding
INDEX- Magnetic, mechanical and thermal properties
- Demagnetization curves（with temperature dependence）
- Magnetizing, Alignment and demagnetizing properties
- Stability（at 80℃90%RH、120℃Dry）
- Recomended molding conditions
-
Wellmax™-S4 Series
Anisotropic SmFeN (Samarium-Iron-Nitrogen) mixed Ferrite PA12 magnet pellet for injection molding
INDEX- Magnetic, mechanical and thermal properties
- Demagnetization curves（with temperature dependence）
- Magnetizing, Alignment and demagnetizing properties
- Stability（at 80℃Dry）
- Recomended molding conditions
-
Wellmax™-S5P Series
Anisotropic NdFeB mixed SmFeN PPS magnet pellet for injection molding
INDEX- Magnetic, mechanical and thermal properties
- Demagnetization curves（with temperature dependence）
- Magnetizing, Alignment and demagnetizing properties
- Stability（at 80℃ and 150℃Dry）
- Recomended molding conditions
Fine Copper Powders
-
Oxidation-resistant submicron copper powder
Overview of UCP series
INDEX- Features
- Product Characteristics
- The relationship between the particle size of fine copper powder and sintering behavior
-
Oxidation Resistant Copper Powder
UCP-030N
INDEX- Overview
- Features
- Characteristics
- Others
MOD Paste (Metal Organic Decomposition Paste)
-
MOD Paste (Metal Organic Decomposition Paste)
For conductive material as Printed Electronics
INDEX- Advantage
- Circuit forming process
- Evaluation for Oxidation-resistant
- Application
[Wet-chemical synthesized metal powder] Ultra-fine nickel powders
-
Ultra-fine nickel powders
MIT-60, MIT-100
INDEX- Features
- Uniform particle size distribution generated by wet synthesis method
- Spherical particles with minimal surface irregularities
- Characteristics
- Particle size distribution of nickel powder
- Sinterability of nickel powder (measured by TMA)
Fe-Ga Alloy Single Crystal
-
Fe-Ga Alloy Single Crystal
R&D product
INDEX- Feature of Fe-Ga alloy single crystals
Thermal Grease
-
Non-Silicone-Based Durable Thermal Grease
R&D product
INDEX- To keep printability with high thermal conductivity
- Excellent durability in high temperature range
- Other features
AuSn (Gold-Tin) Solder
-
AuSn(Gold-Tin) Solder
S-Type
INDEX- Thin Oxide Film
- Excellent wettability
Copper-clad laminate (2-layer FCCL, transparent FCCL)
-
Copper-clad laminate (2-layer FCCL, transparent FCCL)
S’PERFLEX
INDEX- Product Overview and Features:
- Advanced metallization technology
- Smooth film interface and thin, uniform copper thickness
- 2-layer FCCL combining organic resin film and freely adjustable copper layer thickness
- Product Lineup:
- Available in various film types, copper layers, and shapes